KBDFans
Tofu60 3.0
Pickup available at Yu Li Industrial Building
Usually ready in 24 hours
About the Tofu60 3.0
The Tofu60 3.0 strikes a perfect balance between heritage and innovation.
Externally, it preserves the beloved minimalist contour of its predecessor, the Tofu60 2.0.
Beneath the surface, however, the internal architecture has been meticulously reimagined.
This is more than just a new design attempt; it is the definitive continuation of a classic.
In the box
- Top case x1
- Bottom case x1
- Optional weight bars x2
- Silicone gasket x1 set
- Rubber feet x1 set
- PCB x1
- Daughterboard x1
- Optional foam kit x1 set
- Battery compartment foam kit x1 set
- Optional plate x1
- Carrying case x1
Specifications
- Top case material: Aluminum (anodized/e-coating/RAW)
- Bottom case material: Aluminum/Copper/Stainless Steel (anodized/e-coating/RAW/textured/Sandblasted)
- Mounting style: Top Mount/PCB Gasket
- PCB: 1.6mm, 4 options, solder/wired hotswap/Dual-mode hotswap/HE
- Plate: Alu/Carbon fiber/PC/PEI/FR4 Plate
- Typing angle: 9 degree
- Weight bar: Aluminum, Stainless Steel, and Copper
- Designer: Wei
Group Buy Details
- Estimated Date of Arrival:Q2 2026
- Group Buy Ends:January 30, 2026
Fulfilment/ Delivery time are an estimate, please check our Discord for the latest update on the project
Group Buy & Pre-Order Policy
Please do not add in-stock items to your cart with this product. If you do... JUST DON'T.
For more information, please read our Group Buy and Pre-Order Policy here.
Case Design
Craftsmanship & Finish
Expertly crafted, the Tofu60 3.0 case comes in two premium finishes.
Choose the silky-smooth feel of sandblasted anodized aluminum or the fine, matte texture of our rich E-coating.
Both perfectly highlight the case's clean, sculpted lines.
Visual Language
Visually, the Tofu60 3.0 introduces a bold design language.
The bottom case features an exposed rear accent, splitting the USB port face into two distinct sections.
This innovative construction enables striking two-tone color combinations, both immediately captivating and enduringly timeless.
Structural Integrity
Internally, the Tofu60 3.0 carries forward the minimalist design heritage of the TOFU family while introducing a versatile dual-mounting system.
This allows users to choose between a classic TOP Mount for a firm, responsive feel, or a PCB Gasket Mount for a softer, more flexible typing experience, catering to diverse preferences.
Integrated Force Break System
The design includes custom-molded Force Break silicone pads.
These pads create a buffer between case components, effectively dampening case vibration and eliminating unwanted metallic "ping," ensuring a cleaner sound.
Mounting Styles
PCB Gasket Mount
Engineered for Softness
Following a similar support distribution as the TOP Mount, the PCB Gasket is designed to provide a maximally soft, bouncy, and flexible typing experience.
Plateless Build Potential
Combine this mount with the solderable PCB to assemble your board without a plate. This "plateless" configuration is the ultimate choice for achieving maximum flex and a unique, deep sound profile.
Top Mount
Optimized TOP Mount Structure
To minimize resonance and hollowness, the mounting points for the TOP structure are strategically placed to avoid the spacebar area. This results in a more uniform and satisfying sound signature.
Plate-Mount Silicone Dampeners
Silicone dampeners provide complete physical decoupling of the positioning plate from the upper housing. This design mitigates resonance conduction at its origin, significantly reducing structural noise
PCB Options
Wired PCB
Dive into deep customization with support for AVA, VIAL, and VIA. The solder version also allows for a unique plateless build option.
- 1.6mm thickness
- FR4 material
- Solder version/ Hotswap version
- Magnetic connector PCB
- Json file:ydkb_kbdfans_tofu60_3_0_via.json
- Firmware: ydkb_kbdfans_tofu60_3_0_vial.uf2
Dual-Mode PCB
Experience the freedom of wireless with our first-ever dual-mode board powered by ZMK. Its ultra-low power consumption delivers an incredible 6+ months of battery life from a single 1000mAh battery.
- 1.6mm thickness
- FR4 material
- Hotswap version
- Magnetic connector PCB
HE (Magnetic) PCB
Engineered for victory. We've partnered with NNKS to create a next-gen Hall Effect PCB focused on what matters most: ultra-low latency.
- New Daisy-Chain Architecture: Reduces input delay.
- Stable 0.01mm Resolution: Precision where it counts.
- Web-Based Configurator: Easy, on-the-fly adjustments.
- Continuous Firmware Updates: Always stay ahead of the curve.
Layouts
Wired PCB and Dual-mode PCB layout




