KBDFans
Tofu65 3.0 Plate
Pickup available at Yu Li Industrial Building
Usually ready in 24 hours
Build your Tofu
Build it here: Builder
Specifications
- Top case material: Aluminum (anodized/e-coating/RAW)
- Bottom case material: Aluminum/Copper/Stainless Steel (anodized/e-coating/RAW/textured/Sandblasted)
- Mounting style: Top Mount/PCB Gasket
- PCB: 1.6mm, 4 options, solder/wired hotswap/Dual-mode hotswap
- Plate: Alu/Carbon fiber/PC/PEI/FR4 Plate
- Typing angle: 9 degree
- Weight bar: Aluminum, Stainless Steel, and Copper
- Designer: Wei
What's in the box
- Top case x1
- Bottom case x1
- Optional weight bars x2
- Silicone gasket x1 set
- Rubber feet x1 set
- PCB x1
- Daughterboard x1
- Optional foam kit x1 set
- Battery compartment foam kit x1 set
- Optional plate x1
- Carrying case x1
Group Buy details
- Pre-order date: Jan 30 to Feb 28, 2026
- ETA: Around the end of Q2, 2026
Disclaimer: Please note that ETA's are subject to administrative and shipping delays.
Group Buy & Pre-Order Policy
Please note: Do not add in-stock items to your cart with this product. The Evo75 and its addons are Pre-Order products.
For more information, please read our Group Buy and Pre-Order Policy here.
TOFU65 3.0
The Icon, Refined
As the third evolution in the series, the Tofu65 3.0 strikes a perfect balance between heritage and innovation.
Externally, it preserves the beloved minimalist contour of its predecessor, the Tofu65 2.0.
Beneath the surface, however, the internal architecture has been meticulously reimagined.
The Tofu65 3.0 is more than just a new design attempt; it is the definitive continuation of a classic.
Mounting Styles
PCB Gasket Mount
Engineered for Softness
Following a similar support distribution as the TOP Mount, the PCB Gasket is designed to provide a maximally soft, bouncy, and flexible typing experience.
Plateless Build Potential
Combine this mount with the solderable PCB to assemble your board without a plate. This "plateless" configuration is the ultimate choice for achieving maximum flex and a unique, deep sound profile.
We recommend a solder PCB for this build
Top Mount
Optimized TOP Mount Structure
To minimize resonance and hollowness, the mounting points for the TOP structure are strategically placed to avoid the spacebar area. This results in a more uniform and satisfying sound signature.
Top Case Mount Silicone Dampeners
Silicone dampeners provide complete physical decoupling of the positioning plate from the upper housing. This design mitigates resonance conduction at its origin, significantly reducing structural noise. Top case mount method is easier to install.
PCB Options
Wired PCB (Solder & Hot-Swap)
Dive into deep customization with support for AVA, VIAL, and VIA. The solder version also allows for a unique plateless build option.
- 1.6mm thickness
- FR4 material
- Solder version/ Hotswap version
- Magnetic connector PCB
- Json file:ydkb_kbdfans_tofu65_3_0_via.json
- Firmware: ydkb_kbdfans_tofu65_3_0_vial.uf2
Dual-Mode PCB
Experience the freedom of wireless with our first-ever dual-mode board powered by ZMK. Its ultra-low power consumption delivers an incredible 6+ months of battery life from a single 1000mAh battery.
- 1.6mm thickness
- FR4 material
- Hotswap version
- Magnetic connector PCB
Batteries are sold separately. Please remember to purchase them from the PCB page.
